Product features
Product function
産品簡介：
Product introduction:
Leetop_ALP_608_F是(shì)基于(yú)英伟达(dá)Orin NANO/Orin NX 核心板研發(fà)的(de)一(yī) 款嵌入(rù)式人(rén)工智能(néng)计算机， 能(néng)夠为衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)20/40/70/ 100TOPS的(de)计算力。 Jetson Orin NANO/Orin NX 可(kě)以和(hé)NVIDIA強(qiáng)大(dà)的(de)AI 软(ruǎn)件(jiàn)堆(duī)栈/SDK 及(jí)软(ruǎn)件(jiàn)平台(tái)相結合，作(zuò)为高(gāo)性(xìng)能(néng)低(dī)功耗的(de)嵌入(rù)式邊(biān)緣计算設備 ，主(zhǔ)要(yào)應(yìng)用(yòng)于(yú)制造、物(wù)流、零(líng)售、服(fú)務(wù)、农業、智慧城(chéng)市(shì)、醫疗保健、生(shēng)命 科學(xué)等領域的(de)先(xiān)進(jìn)人(rén)工智能(néng)机器人(rén)、邊(biān)緣檢測設備和(hé)A I應(yìng)用(yòng)场(chǎng)景. Leetop_ ALP_608_F提(tí)供快(kuài)速的(de)主(zhǔ)动散(sàn)热(rè)設计， 可(kě)以滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。 同(tóng) 时(shí)Leetop_ALP_608_F接口豐富性(xìng)價比高(gāo)。
Leetop_ ALP_ 608_ F is an embedded artificial intelligence computer developed based on the NVIDIA Orin NANO/Orin NX core module, which can provide up to 20/40/70/100 TOPS of computing power to numerous terminal devices. Jetson Orin NANO/Orin NX can be combined with NVIDIA's powerful AI software stack/SDK and software platform. As a high-performance and low-power embedded edge computing device, it is mainly used in advanced artificial intelligence robots, edge detection devices and AI application scenarios in manufacturing, logistics, retail, service, agriculture, smart city, health care, life science and other fields Leetop_ ALP_ 608_ F provides a fast active heat dissipation design that can meet industrial standards such as earthquake resistance and anti-static. Meanwhile, Leetop_ ALP_ 608_ F interface is rich and cost-effective.
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
| Jetson Orin NX 8GB | Jetson Orin NX 16GB | |
| AI Performance | 70 TOPS | 100 TOPS |
| GPU | 1024-core NVIDIA Ampere GPU with 32 Tensor Cores | |
| CPU | 6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core NVIDIA Arm ® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
| Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Memory | 8 GB 128-bit LPDDR5 102.4 GB/s | 16 GB 128-bit LPDDR5 102.4 GB/s |
| Storage | — (Supports external NVMe) | |
| Jetson Orin Nano 4GB | Jetson Orin Nano 8GB | |
| AI Performance | 20TOPS | 40TOPS |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
| CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
| Video Encode | 1080p30 supported by 1-2 CPU cores | |
| Video Decode | 1x 4K60 (H.265) 2x4K30 (H.265) 5x1080p60 (H.265) 11x1080p30 (H.265) | |
| Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
| Storage | — (Supports external NVMe) | |
産品規格 :
Product specification：
| Feature | Specification |
| Display | 1x DP |
| Ethernet | 2x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.2 Type A (Integrated USB 2.0) 1x USB 2.0+3.2 Type C |
| Camera | 2xCSI Camera |
| FAN | 1xFAN(5V PWM) |
| RTC CON | 1x 3.0V RTC |
| CAN | 1xCAN (FD) |
| Audio | 1x3.5 Audio Jack; 2X MIC; 2X SPEAKER; 1X SPEAKER FEEDBACK |
| Function CON | 2X IIC; 1X SPI; 7X IO 3.3V; 2x UART; 1X DEBUG; 1X POWER; 1X RESET; 1X RECOVERY |
| DC | Power interface |
産品規格
Product specification：
| Project | Spec |
| Input Voltage | +9-- +20V(MAX 60W) DC Input |
| Load capacity | Above 60W |
| Dimensions (W×D ×H) | 126x107x39.5(mm) |
| Operating Temperature | -25℃-65℃ |
Storage Temperature Humidity | -25℃-65℃ 10% -90% non condensation environment |
| Weight | 0.6546KG |
尺(chǐ)寸示意(yì)图(tú)：
Schematic diagram of dimensions：
| 正(zhèng)视图(tú) Front view | 左(zuǒ)视图(tú) Left view |
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| 俯视图(tú) Up view | 後(hòu) 视 图(tú) Rear view |
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