Product features
Product function
産品簡介：
Product introduction:
Leetop_ALP_682_F是基于(yú)英伟达(dá)AGX Orin 核心(xīn)闆研發(fà)的(de)一(yī)款嵌入式人(rén)工 智能計(jì)算機(jī)， 能夠为(wèi)衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)200/275TOPS的(de)計(jì)算力。 Jetson AGX Orin 可(kě)以(yǐ)和(hé)NVIDIA強(qiáng)大(dà)的(de)AI软(ruǎn)件(jiàn)堆(duī)棧/SDK及(jí)软(ruǎn)件(jiàn)平台(tái)相結合，作(zuò)为(wèi)高(gāo)性(xìng) 能低(dī)功耗的(de)嵌入式邊(biān)緣計(jì)算設備，主(zhǔ)要(yào)應(yìng)用(yòng)于(yú)制造、物(wù)流、零(líng)售、服(fú)務(wù)、農業、 智慧城(chéng)市(shì)、醫療保健、生(shēng)命科學(xué)等領域的(de)先(xiān)進(jìn)人(rén)工智能機(jī)器人(rén)、邊(biān)緣檢測設備和(hé) A I應(yìng)用(yòng)场景。Leetop_ALP_682_F提(tí)供快(kuài)速的(de)主(zhǔ)動(dòng)散(sàn)热(rè)設計(jì)， 可(kě)以(yǐ)滿足抗震防 静(jìng)電(diàn)等工業标(biāo)準。 同(tóng)时(shí)Leetop_ALP_682_F接口(kǒu)豐富性(xìng)價比高(gāo)。
Leetop_ALP_682_F is an embedded artificial intelligence computer developed based on NVIDIA AGX Orin core module, which can provide computing power of up to 200/275TOPS to many terminal devices. Jetson AGX Orin can be combined with NVIDIA's powerful AI software stack/SDK and software platform. As a high-performance and low-power embedded edge computing device, it is mainly used in manufacturing, logistics, retail, services, agriculture, smart cities, and healthcare. Advanced artificial intelligence robots, edge detection equipment and AI application scenarios in fields such as , life sciences and other fields. Leetop_ALP_682_F provides fast active heat dissipation design and can meet industrial standards such as shock resistance and anti-static. At the same time, Leetop_ALP_682_F has rich interfaces and is cost-effective.
産品規格 Productspecification：
處(chù)理(lǐ)器模块(kuài) Processor module：
| specifications | ||
| Module | Jetson AGXOrin 32GB | Jetson AGX Orin 64GB |
| AI Performance | 200 TOPS | 275 TOPS |
| CPU | 1792-core NVIDIA Ampere GPU with56 Tensor Cores | 2048-core NVIDlA Ampere GPU with64 Tensor Cores |
| GPU | 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU2MB L2 + 4MB L3 | 12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU3MB L2 + 6MB L3 |
| Memory | 32 GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 | |
| Video Encode | 1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) | 2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265 |
| Video Decode | 1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
| Power | 15W - 40W | 15W - 60W |
産品規格 ：
Product specification：
| Feature | Specification |
| Module Compatibility | Jetson AGX Orin |
| Display | 1x DP |
| Ethernet | 1x Gigabit Ethernet (10M/100M/1000M) |
| 4x10G(10M/100M/1000M) | |
| USB | 4x USB 3.2Type A (Integrated USB 2.0) 1x USB2.0+ 3.2 (TYPE C) |
| Audio | 1XAudio |
| TF_Card | 1X TF_Card |
| SIM_Card | 1x SIM_Card |
| Function Key | 1x Power key; 1x Reset key; 1x Recovery key; |
| DC | power interface |
| Project | Specification |
| Input Voltage | +12-36V(120W) DC Input |
| Load capacity | Above 90W |
| Dimensions (W×D ×H) | 224x164x66.35(mm) |
| Operating Temperature | -25℃- 70℃ |
Storage Temperature Humidity | -25℃ -65℃ 10% -90% Non condensation environment |
| Weight | 2.6KG |
尺(chǐ)寸(cùn)示意(yì)图(tú)：
Schematic diagram of dimensions：
| 正(zhèng)視图(tú) Front view | 左(zuǒ)視图(tú) Left view |
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| 俯視图(tú) Up view | 後(hòu)視图(tú) Rear view |
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