産品特(tè)點(diǎn)
産品功能(néng)
産品簡介：
Product introduction:
Leetop_HLY-D5162F是(shì)基于(yú)英伟达(dá)AGX Orin核心板研發(fà)的(de)一(yī)款先(xiān)進(jìn) 的(de)嵌入(rù)式人(rén)工智能(néng)计算机。該计算机为衆多(duō)終(zhōng)端設備提(tí)供高(gāo)达(dá)200/275 TOPS的(de)強(qiáng)大(dà)计算能(néng)力。搭载(zài)Jetson AGX Orin核心板，Leetop_HLY- D5162F能(néng)夠充分(fēn)發(fà)挥NVIDIA強(qiáng)大(dà)的(de)AI软(ruǎn)件(jiàn)堆(duī)栈、SDK以及(jí)软(ruǎn)件(jiàn)平台(tái)的(de) 優勢，成(chéng)为一(yī)款高(gāo)性(xìng)能(néng)低(dī)功耗的(de)嵌入(rù)式邊(biān)緣计算設備。
Leetop_HLY-D5162F的(de)机箱(xiāng)設计符合标(biāo)準的(de)19英寸机架，使其(qí)在(zài)數據(jù) 中(zhōng)心、服(fú)務(wù)器机房(fáng)等环(huán)境中(zhōng)得到(dào)廣泛應(yìng)用(yòng)。Leetop_HLY-D5162F机箱(xiāng) 采用(yòng)堅固的(de)金(jīn)屬材料，提(tí)供卓越的(de)結構強(qiáng)度(dù)和(hé)散(sàn)热(rè)性(xìng)能(néng)，同(tóng)时(shí)滿足工業 标(biāo)準的(de)抗震和(hé)防静(jìng)電(diàn)要(yào)求。
Leetop_HLY-D5162F is an advanced product developed based on NVIDIA AGX Orin core board.of embedded artificial intelligence computers. This computer provides up to 200/275 for numerous end devices.The powerful computing power of TOPS. Equipped with Jetson AGX Orin core moudle, Leetop_HLY-D5162F can take full advantage of NVIDIA's powerful AI software stack, SDK and software platform to become a high- performance and low-power embedded edge computing device. The chassis design of Leetop_HLY-D5162F complies with standard 19-inch racks, making it widely used in data centers, server rooms and other environments. The Leetop_HLY-D5162F chassis is made of solid metal materials, providing excellent structural strength and heat dissipation performance while meeting industry standard anti-seismic and anti-static requirements.
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
| spe cifications | ||
| Module | Jetson AGX Orin 32GB | Jetson AGX Orin 64GB |
AI Pe rformanc | 200TOPS | 275TOPS |
| CPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores |
| GPU | 8 - core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 2MB L2 + 4MB L | 12-core NVIDIA Arm ® Cortex A7 8 AE v8 .2 6 4 - bit CPU 3MB L2 + 6MB L3 |
| Memory | 32 GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 | |
| Video Encode | 1 x 4 K6 0 | 3 x 4 K3 0 | 6 x 1 0 8 0 p6 0 | 12x 1080p30 ( H. 2 6 5 ) 1 x 4 K6 0 | 2 x 4 K3 0 | 5 x 1 0 8 0 p6 0 | 11x 1080p30 (H.264 | 2x 4K60 4x 4K30 8x 1080p60 16x 1080p30 (H.265) 2x 4K60 4x 4K30 7x 1080p60 15x 1080p30 (H.264) |
| V ideo Decode | 1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
| Power | 15W - 40W | 15W - 60W |
産品規格 ：
Product specification ：
| Feature | Sp ecification |
| Module Com pat ibilit y | Jetson AGX Orin |
| Display | 1x DP |
| Et hernet | 1x Gigabit Ethernet (10M/100M/1000M) 4x10G(10M/100M/1000M) |
| USB | 4x USB 3.2Type A (Integrated USB 2.0) |
| Function Key | 1x Power key; |
| AC | power interface |
| Project | Specification |
| Input Voltage | 100~240V(3A) A C Input |
| Load capacity | Above 90W |
| Dimensions (W×D ×H) | 490x257x44.5(mm) |
| Operating Temperature | -25℃- 70℃ |
St orage Temperat ure Hu midity | -25 ℃ -65 ℃ 10% -90% Non condensation environmen |
| Weight | KG |
尺(chǐ)寸示意(yì)图(tú)：
Dimensional diagram：
| 正(zhèng)视图(tú) Front view | 左(zuǒ)视图(tú) Left view |
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| 俯视图(tú) Top view | 後(hòu)视图(tú) Rear view |
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