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带(dài)*号(hào)为必填選项,提(tí)交後(hòu)我(wǒ)司会(huì)安(ān)排商務(wù)邮(yóu)箱(xiāng)發(fà)送給(gěi)您对應(yìng)的(de)産品PDF文(wén)檔.

産品特(tè)點(diǎn)

産品功能(néng)

産品簡介:

Product introduction:


Leetop_ALP_603_F 是(shì)基于(yú)英伟达(dá)Orin Nano/Orin Nx核心板研發(fà)的(de)一(yī)款嵌入(rù)式人(rén)工智能(néng)计算机,能(néng)夠为衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)20/40/70/100TOPS的(de)计算力。Leetop ALP_603F 提(tí)供快(kuài)速的(de)主(zhǔ)动散(sàn)热(rè)設计可(kě)以滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。同(tóng)时(shí) Leetop ALP_603 F 接口豐富,性(xìng)價比高(gāo)。


Leetop_ALP_603_F is an embedded artificial intelligencecomputer developed based on the NVIDIA Orin Nano/Orin Nxcore board,which can provide up to 20/40/70/100TOPS computingpower for many terminal devices. Leetop_ALP_603_F provides afast active cooling design, which can meet industrial standardssuch as shock resistance and anti-static. At the same timeLeetop_ALP_603_F has rich interfaces and high costperformance.


産品規格 Product Specifications

處(chù)理(lǐ)器模块(kuài) processor module


Jetson Orin Nano 4GBJetson Orin Nano 8GB
AI Performance20 TOPS40 TOPS
GPU512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
CPU6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3
Video Encode1080p30 supported by 1-2 CPU cores
Video Decode

1x 4K60 (H.265)

2x 4K30 (H.265) 

5x 1080p60 (H.265) 

11x 1080p30 (H.265)

Memory4GB 64-bit LPDDR5 34 GB/s8GB 128-bit LPDDR5 68 GB/s
Storage

(Supports external NVMe)


Jetson Orin NX 8GBNX 8GB Jetson Orin NX 16GB
AI Performance70 TOPS100 TOPS
GPU1024-core NVIDIA Ampere GPU with 32 Tensor Cores
CPU6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L38-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3
Video Encode1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264)
Video Decode1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264)
Memory8 GB 128-bit LPDDR5 102.4 GB/s16 GB 128-bit LPDDR5 102.4 GB/s
Storage

(Supports external NVMe)


接口I/O

接口 Interface規格 Specification
Network1 × Gigabit Ethernet Connector (10/100/1000)
USB2x USB 3.0 Type A (Integrated USB 2.0) 1x USB 3.0 0.5mm pitch 20P ZIF 1x USB 2.0 Micro-AB
Video output1 × HDMI
SIM Card1x SIM Card
CAN1 × CAN
RS2321x RS232
power+9V to +20V DC Input @ 7A


供電(diàn) Power Supply

Power SupplySpec
Input Voltage+9--+20V DC Input @7A
Power consumptionAbove 60W


結構Mechanical

MechanicalSpec
Dimensions (W×D ×H)100x59x51(mm)
Weight0.4KG


环(huán)境Environmental

EnvironmentaSpec
Operating Temperature-25℃-65℃ 0.2~0.3m/s气(qì)流
Storage Humidity-20℃-60℃
Storage Humidity10%-90% Non-condensing environment 非(fēi)結露(lù)环(huán)境


尺(chǐ)寸示意(yì)图(tú)Schematic diagram of dimensions

正(zhèng)视图(tú) Front view左(zuǒ)视图(tú) Left view
image.pngimage.png
俯视图(tú) Up view底部(bù)图(tú) Bottom view
image.pngimage.png


選配表(biǎo)Matching table

Product nameCore moduleSSDcommunicationpower
ALP_603_F




J1:Orin Nano(4G)



J2:Orin Nano(8G)



J3:Orin NX(8G)



J4:Orin NX(16G)




N



128G



256G



512G



1T




N



4G



5G




N




01:明(míng)緯




02:定(dìng)制


在(zài)線(xiàn)咨詢

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