産品特(tè)點(diǎn)
産品功能
産品簡介：
Product introduction：
Leetop_ALP_607_F是基于(yú)英伟达(dá)Orin NX/Orin Nano核心(xīn)闆研發(fà)的(de)一(yī)款嵌入式人(rén)工智能計(jì)算機(jī)，能夠为(wèi)衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)20/40/70/100TOPS的(de)計(jì)算力。Leetop_ALP_607_F提(tí)供快(kuài)速的(de)主(zhǔ)動(dòng)散(sàn)热(rè)設計(jì)，可(kě)以(yǐ)滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。同(tóng)时(shí)Leetop_ALP_607_F接口(kǒu)豐富，性(xìng)價比高(gāo)。
Leetop ALP 607 F is an embedded artificial intelligencecomputer developed based on NVIDIA's Orin NX/Orin Nano coreboard, which can give up to 20/40/70/100TOPS computingpower to many terminal devices. Leetop_ALP_607_F provides afast active heat dissipation design that can meet industrystandards such as anti-vibration and anti-static.At the sametime, Leetop ALP 607 F interfaces are rich and cost-effective
産品規格 Product Specifications
處(chù)理(lǐ)器模块(kuài) processor module
| Jetson Orin Nano 4GB | Jetson Orin Nano 8GB | |
| AI Performance | 20 TOPS | 40 TOPS |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
| CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
| Video Encode | 1080p30 supported by 1-2 CPU cores | |
| Video Decode | 1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) | |
| Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
| Storage | — (Supports external NVMe) | |
| Jetson Orin NX 8GB | Jetson Orin NX 16GB | |
| AI Performance | 70 TOPS | 100 TOPS |
| GPU | 1024-core NVIDIA Ampere GPU with 32 Tensor Cores | |
| CPU | 6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
| Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Memory | 8 GB 128-bit LPDDR5 102.4 GB/s | 16 GB 128-bit LPDDR5 102.4 GB/s |
| Storage | — (Supports external NVMe) | |
接口(kǒu)I/O
| 接口(kǒu) Interface | 規格 Specification |
| Network | 2 × Gigabit Ethernet Connector (10/100/1000) |
| USB | 4x USB 3.0 Type A (Integrated USB 2.0) 1x USB 2.0+3.0 Type |
| Video output | 1 × HDMI |
| CAN | 1 × CAN 1CAN（接.收發(fà)器） |
| RS485 | 1 x RS485 |
| RS232 | 1 x RS232 |
| SPI Bus | 1 × SPI Bus(+3.3V Level) |
| Power | +12（7A)--+36V(3A) DC Input |
供電(diàn) Power Supply
| Power Supply | Spec |
| Input Voltage | +12（7A)--+36V(3A) DC Input |
| Power consumption | 70W |
結构Mechanical
| Mechanical | Spec |
| Dimensions (W×D ×H) | 180x109.6x40(mm) |
| Weight | 805.8g |
环(huán)境Environmental
| Environmenta | Spec |
| Operating Temperature | -20℃-75℃ 0.2~0.3m/s气(qì)流 |
| Storage Temperature | -20℃-60℃ |
| Storage Humidity | 10%-90% non-condensing 非(fēi)結露环(huán)境 |
尺(chǐ)寸(cùn)示意(yì)图(tú)Schematic diagram of dimensions
| 正(zhèng)視图(tú) Front view | 左(zuǒ)視图(tú) Left view |
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| 俯視图(tú) Up view | 底部(bù)图(tú) Bottom view |
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選配表(biǎo)Matching table
| Product name | Core module | SSD | communication | power |
| ALP-607-F | ||||
| J1:Orin Nano(4G) | ||||
| J2:Orin Nano(8G) | ||||
| J3:Orin NX(8G) | ||||
| J4:Orin NX(16G) | ||||
| N | ||||
| 128G | ||||
| 256G | ||||
| 512G | ||||
| 1T | ||||
| N | ||||
| 4G | ||||
| 5G | ||||
| N | ||||
| 01:明(míng)緯 | ||||
| 02:定(dìng)制 |