産品特(tè)點(diǎn)
産品功能
産品簡介：
Product introduction:
Leetop_SUBKIT_610_Orin_NX是基于(yú)英伟达(dá)Orin NX核心(xīn)闆研發(fà)的(de) 款嵌入式人(rén)工智能計(jì)算機(jī)，能夠为(wèi)衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)70/100TOPS的(de)計(jì)算力。Jetson Orin NX可(kě)以(yǐ)和(hé)NVIDIA強(qiáng)大(dà)的(de)AI软(ruǎn)件(jiàn)堆(duī)棧/SDK及(jí)软(ruǎn)件(jiàn)平台(tái)相結 合，作(zuò)为(wèi)高(gāo)性(xìng)能低(dī)功耗的(de)嵌入式邊(biān)緣計(jì)算設備，主(zhǔ)要(yào)應(yìng)用(yòng)于(yú)制造、物(wù)流、零(líng) 售、服(fú)務(wù)、農業、智慧城(chéng)市(shì)、醫療保健、生(shēng)命科學(xué)等領域的(de)先(xiān)進(jìn)人(rén)工智能機(jī)器 人(rén)、邊(biān)緣檢測設備和(hé)AI應(yìng)用(yòng)场景。 Leetop_SUBKIT_610_Orin_NX提(tí)供快(kuài)速的(de) 主(zhǔ)動(dòng)散(sàn)热(rè)設計(jì)，可(kě)以(yǐ)滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。同(tóng)时(shí)
Leetop_SUBKIT_610_Orin_NX接口(kǒu)豐富性(xìng)價比高(gāo)。
Leetop_SUBKIT_610_Orin_NX an embedded artificial intelligence computer based on NVIDIA's Orin NX core module, which can give up to 70/100TOPS computing to many terminal devices Force. Jetson Orin NX can be combined with NVIDIA's powerful AI software stack/ SDK and software platform as a high-performance and low-power embedded edge computing device, mainly used in manufacturing, logistics, retail, services, agriculture, smart city, healthcare, life sciences and other fields of advanced artificial intelligence robots, edge detection equipment and AI application scenarios. Leetop_ SUBKIT_610_Orin_NX provides a fast active heat dissipation design that can meet industry standards such as anti-vibration and anti-static . meantime Leetop_SUBKIT_610_Orin_NX interfaces are abundant and cost-effective.
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
| Jetson Orin NX 8GB | Jetson Orin NX 16GB | |
| AI Performance | 70 TOPS | 100 TOPS |
| GPU | 1024-core NVIDIA Ampere GPU with 32 Tensor Cores | |
| CPU | 6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core NVIDIA Arm ® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
| Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Memory | 8 GB 128-bit LPDDR5 102.4 GB/s | 16 GB 128-bit LPDDR5 102.4 GB/s |
| Storage | — (Supports external NVMe) | |
| Project | Spec |
| Input Voltage | +10---+24V(60W) DC Input |
| Load capacity | Above 60W |
| Dimensions (W×D ×H) | 104.9x100.08x33.05 (mm) |
| Operating Temperature | -25℃-70℃ |
Storage Temperature /Humidity | -25℃-65℃ 10%-90% Non Condensing Environment |
| Weight | 0.18615KG |
| Interface | Specification |
| Network | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 Type A (Integrated USB 2.0) 3X USB(CONNECT) 1x USB2.0 (TYPE C) |
| Video output | 2× HDMI |
| Function key | 1x Power key; 1xRcecovery key ; 1xReset key |
尺(chǐ)寸(cùn)示意(yì)图(tú) ：
Schematic diagram of dimensions：
| 正(zhèng)視图(tú) Front view | 左(zuǒ)視图(tú) Left view |
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| 俯視图(tú) Up view | 底部(bù)图(tú) Bottom view |
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