産品特(tè)點(diǎn)
産品功能
産品簡介：
Product introduction:
Leetop_B100_Kit是一(yī)款設計(jì)獨特(tè)、性(xìng)能卓越的(de)開(kāi)發(fà)套(tào)件(jiàn)，搭载(zài)了(le)強(qiáng)大(dà)的(de)RDK X3模組。其推理(lǐ)算力高(gāo)达(dá)5 Tops， 同(tóng)时(shí)搭载(zài)了(le)4核ARM Cortex®A53處(chù)理(lǐ)器，为(wèi)用(yòng)戶提(tí)供卓越的(de) 計(jì)算性(xìng)能。支持(chí)3路(lù)CSI Camera接口(kǒu)，使其适用(yòng)于(yú)各(gè)種(zhǒng)視覺應(yìng)用(yòng)。 此(cǐ)外(wài)，Leetop_B100_Kit還(huán)配備了(le)4路(lù)USB3.0接口(kǒu)和(hé)2路(lù)USB2.0 接口(kǒu)，为(wèi)用(yòng)戶提(tí)供多(duō)樣(yàng)化(huà)的(de)外(wài)設連(lián)接選项，充分(fēn)滿足各(gè)類(lèi)场景的(de) 使用(yòng)需求。
Leetop_B100_Kit is a development tool with unique design and excellent performance The kit is equipped with the powerful RDK X3 module. Its reasoning computing power is as high as 5 Tops.It is also equipped with an 4-core ARM Cortex®A53 processor to provide users with excellent computing performance.Supports 3-way CSI Camera interface, making it suitable for various vision applications. In addition, Leetop_B100_Kit is also equipped with 4 USB3.0 interfaces and 2 USB2.0 interfaces.Provide users with a variety of peripheral connection options to fully meet the needs of various scenarios.
産品規格 ：
Product specification ：
| Project | Sp ecification |
| Module Compa tibility | RDK X3 Moudle |
| Displa y | 1x HDMI |
| Et hernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 2x SPEAKER; 1x Audio jack |
| Camera | 3x CSI Camera |
| FAN | 1xFAN(5V PWM) |
| RTC CON | 1x3.0V RTC |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Operating Temperature | -20℃-60℃ |
Storage Temperat ure Humidit | -20℃-60℃ 10% -90% Non condensation environment |
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
RDK X3 Moudle 主(zhǔ)要(yào)包含四核Cortex®A53處(chù)理(lǐ)器、5Tops算力、最高(gāo)4GB內(nèi)存且(qiě)支持(chí)4K@60幀視頻編解(jiě)；主(zhǔ)要(yào)接口(kǒu)包括 HDMI、千(qiān)兆(zhào)以(yǐ)太网(wǎng)、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡(kǎ)接口(kǒu)等。
模組搭载(zài)双(shuāng)頻 2.4/5.0GHz 無線(xiàn)局(jú)域网(wǎng)和(hé)藍(lán)牙(yá) 4.2 模块(kuài)，單闆上(shàng)已具備 PCB 天(tiān)線(xiàn)，同(tóng)时(shí)也(yě)可(kě)以(yǐ)搭配外(wài)部(bù)天(tiān)線(xiàn)套(tào)件(jiàn)使用(yòng)，能夠實(shí)現(xiàn)無線(xiàn)連(lián)接，降低(dī)用(yòng)戶開(kāi)發(fà)和(hé) 測試成(chéng)本(běn)，縮短(duǎn)上(shàng)市(shì)时(shí)间。
RDK X3 Module 可(kě)選的(de)闆载(zài) RAM 容量(liàng)包括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex® A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
尺(chǐ)寸(cùn)示意(yì)图(tú)：
Dimensional diagram：
| 正(zhèng)視图(tú) Front view | 左(zuǒ)視图(tú) Left view |
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| 俯視图(tú) Top view | 底部(bù)視图(tú) Bottom view |
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